The new standard will be a key enabler in driving a market-wide adoption of DDR5 DRAM. The new DRAM has been built using a new material that increases cell capacitance and proprietary design technology that improves critical circuit characteristics. It is based on EUV lithography that will allow a higher die density and 20% better wafer productivity. The DRAM consumes 23% less power which paves way for better environment-friendly operations among IT companies. The DRAM uses the latest DDR5 standard and can reach speeds of up to 7.2 gigabits per second allowing for the quick processing of two 30-gigabyte UHD movies in just one second. With mass production set to begin in 2023, Samsung plans to broaden its DRAM lineup built on this cutting-edge 12nm-class process technology into a wide range of market segments. The company will continue to work with industry partners to support the rapid expansion of next-generation computing. The first DDR5 DRAM sticks are expected to ship in 2023. “Innovation often requires close collaboration with industry partners to push the bounds of technology,” said Joe Marci, VP, Corporate Fellow, and Client, Compute, and Graphics CTO at AMD.
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